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 05224
PRSB6.8C
Only One Name Means ProT ek'TionTM
ST ANDARD TVS COMPONENTS
APPLICA TIONS Noise Suppression for Data Lines Laptop Computers Cellular Phones Digital Cameras Personal Digital Assistants (PDAs)
IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES 10 Watts Peak Pulse Power per Line (tp = 10/1000s) ESD Protection > 40 kilovolts Bidirectional Configuration Protects One Data Line Low Clamping Voltage Easy Placement for Manufacturing LOW CAPACITANCE RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS DFN-2 Package Weight 0.73 milligrams (Approximate) Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Pure-Tin - Sn, 100: 260-270C Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 Device Part Number on Reel & Marking Code on Device
PIN CONFIGURA TION
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PRSB6.8C
DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 10/1000s) - See Figure 1 Power Dissipation Junction Temperature Storage Temperature Operation Temperature SYMBOL PPk P TJ Tstg Topr VALUE 10 150 150 -55 to 150 -50 to 150 UNITS W mW C C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER DEVICE MARKING RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE
VWM VOLTS PRSB6.8C A 4.7
@ 1mA V(BR) VOLTS 5.7
@3.5V ID A 1.0
0V @ 1 MHz C pF 15
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PRSB6.8C
GRAPHS
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
1,000
PPP - Peak Pulse Power - kilowatts
100 10W 10/1000s Waveform 10
0 0.1
1
10 100 1,000 td - Pulse Duration - s
10,000
100,000
120
IPP - Peak Pulse Current - % of IPP
FIGURE 2 PULSE WAVE FORM
tf Peak Value IPP TEST WAVEFORM PARAMETERS tf = 10s td = 1000s
100 80 60 40
e-t
td = t
20 0 0 5 10
IPP/2
15 t - Time - s
20
25
30
FIGURE 3 OVERSHOOT & CLAMPING VOLTAGE
30
5 Volts per Division
25
15
5
-5 ESD Test Pulse: 25 kilovolt, 1/30ns (waveshape)
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PRSB6.8C
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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PRSB6.8C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
A H C
PACKAGE DIMENSIONS
INCHES DIM A B C D E F H
NOTES 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad : 0.003" (0.08mm). 3. Maximum size: 0.052" (1.321mm) by 0.036" (0.914mm).
MILLIMETERS MAX 0.025 0.042 0.022 0.014 0.016 0.014 0.013 MIN 0.58 0.97 0.46 0.25 0.30 0.25 0.28 NOR 0.61 1.02 0.51 0.30 0.36 0.30 0.30 MAX 0.64 1.07 0.56 0.36 0.41 0.36 0.33
D
TOP
B
BOTTOM
E
SIDE
MIN 0.023 0.038 0.018 0.010 0.012 0.010 0.011
NOR 0.024 0.040 0.020 0.012 0.014 0.012 0.012
F
MOUNTING PAD
A
PAD DIMENSIONS
DIM A B C E F MILLIMETERS 0.762 0.025 0.356 0.025 0.381 0.025 1.473 0.050 0.559 0.025 INCHES 0.030 0.001 0.014 0.001 0.015 0.001 0.058 0.002 0.022 0.001
B
C E
;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;; ;;;;;;
T APE & REEL ORIENT TION A
F
TAPE & REEL ORDERING NOMENCLATURE
Solder Print Diameter 0.010" - 0.012" NOTE 1. Top view of tape. Solder PADS face down in tape package. Outline & Dimensions: Rev 0 - 4/05, 06059
1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PRSB6.8C-T75-1). 3. Suffix - LF = Lead Free Pure-Tin Plating: i.e., PRSB6.8C-LF-T75-1.
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. 178mm (7")/330mm(13") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P tmax 0.25
0.80 0.10 1.20 0.10 0.70 0.10 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 2.00 0.10
P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2
E Top cover tape A0 K0 B0 F W
P
User Direction of Feed
COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
5 www.protekdevices.com
05224.R3 9/05


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